Proceedings of 2004 International IEEE Conference on the Asian Green Electronics: Agec
Read Online
Share

Proceedings of 2004 International IEEE Conference on the Asian Green Electronics: Agec January 5-6, 2004, City University of Hong Kong, Hong Kong, Ch by Surface Mount Technology

  • 959 Want to read
  • ·
  • 66 Currently reading

Published by Institute of Electrical & Electronics Enginee .
Written in English

Subjects:

  • Electronics - General,
  • Technology & Industrial Arts

Book details:

The Physical Object
FormatHardcover
Number of Pages253
ID Numbers
Open LibraryOL11000464M
ISBN 10078038203X
ISBN 109780780382039

Download Proceedings of 2004 International IEEE Conference on the Asian Green Electronics: Agec

PDF EPUB FB2 MOBI RTF

Get this from a library! Asian Green Electronics, AGEC. Proceedings of International IEEE Conference on the. [Institute of Electrical and Electronics Engineers;]. Published in: International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of. Article #: Date of Conference: Jan. Date Added to IEEE Xplore: 27 September ISBN Information: Print ISBN: X INSPEC Cited by: Get this from a library! Asian Green Electronics (AGEC), IEEE International Conference on. International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of. Quick Links. Search for Upcoming Conferences IEEE Publication Recommender IEEE Author Center Something went wrong in getting results, please try again later. Quick Links.

Accelerated Stress Testing & Reliability Conference (ASTR), IEEE ; Asian Green Electronics, AGEC. Proceedings of International Conference on ; Business of Electronic Product Reliability and Liability, International Conference on ; Control and Fault-Tolerant Systems (SysTol), 3rd Conference on.   Environmental management in semiconductor and printed circuit board industry in India. Part I: Survey results and case studies International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of. Article #: Date of Conference: Jan. Date Added to IEEE Xplore: 27 September Proceedings of International Conference on Asian Green Electronics, AGEC. Location: Shanghai, China; International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of Location: Hong Kong, China & Shenzhen, China.   TOP BOOKS Proceedings of International IEEE Conference on the Asian Green Electronics: Agec: January , , City University of Hong Kong, Hong Kong, China [And] January , , Mission Hills Resort, Shenzhen, China Mile Markers: The Most Important Reasons Why Women Run Iron Line Diagnostics in X-ray Sources: Proceedings of a Workshop Held in Varenna, .

Proceedings of International IEEE Conference on the Asian Green Electronics (AGEC), , p. Summary Of fundamental importance to enhance the reliability of flip chip on board (FCOB) packages is to avoid the initiation and propagation of various interfacial failures, and therefore, robust interfacial bonds between the underfill and other components are highly desired.   Proceedings of the International IEEE Conference on Asian Green Electronics (AGEC), Jan. , Shenzhen, China Subject CategoriesCited by: (English) In: Proceedings of International IEEE Conference on the Asian Green Electronics (AGEC), , p. Conference paper, Published paper (Refereed) Abstract [en] Flip Chip connections enormously reduces the amount of solder as compared to mounting packaged devices, apart from also offering superior high frequency properties and placement density. Asian Green Electronics, , AGEC, proceedings of International Conference on. International Conference on Asian Green Electronics Design for manufacturability and reliability AGEC: Responsibility: organized by IEEE [and others] ; sponsored by .